没有永远的敌人:Intel和AMD宣布合作打造第八代酷睿​处理器,Kaby Lake-H + Polaris 独显
首页 > 观测 > 数码科技    作者:剧毒术士马文   2017年11月9日 22:40 星期四   热度:3000°   56条评论    
时间:2017-11-9 22:40   热度:3000° 

本文地址:http://www.moepc.net/?post=3501

Intel和AMD宣布合作打造第八代酷睿处理器,采用Intel x86 CPU+ AMD Radeon 显卡,以及HBM2,采用Intel的EMIB将多个芯片封装在同一个处理器内,供新一代高性能轻薄游戏笔记本/NUC搭载。


11.09更新KabyLake-G/Hades Canyon的实体芯片图

DOLwFP4X4AUuLSd_guetzli.jpg

GKUwsC6_guetzli.jpg

与个人预计的一样,性能将在GTX 1050Ti和1060之间,最接近的应该是R9 285/380

供电说明TDP不低,规格上是100W。


img003.jpg

img001.png



新的产品将会归于第八代酷睿家族,将高性能Core-H处理器【KBL-H】和HBM2,以及AMD RTG为Intel定制的第三方独显芯片通过EMIB封装在一个处理器内。相当于Intel从AMD手里买来独显通过胶水EMIB和HBM2黏在一起,再在旁边粘上Intel CPU。CPU依然是原来的CPU,GPU依然是独立的GPU。


Intel和AMD RTG的队伍合作,一同设计了一个全新的半定制显示芯片,并配备HBM2,通过EMIB实现极短距离上的高带宽传输,而省去了interposer增加的高度及其他成本。根据视频信息推断EMIB只在HBM2和GPU之间使用,CPU和GPU之间应该还是传统的PCIe。


【根据目前看到的信息,该独显Polaris架构,1536SP,频率1GHz左右,配备4GB HBM2显存,详细规格见下图。之前所谓“Vega”架构的谣言早就被reddit证伪,测试显示的信息就是gfx804,属于Polaris架构。尽管Polaris不是为HBM2而设计,具体是如何配置的还得等进一步消息。采用Polaris架构意味着AMD自家产品能保持1代架构优势。】


此外没见过〇能网报道出过多次偏差负过泽的。你们“媒体”都是这样,出了事了比香港记者逃得还快。


“我们与Intel的合作能够拓展AMD Radeon GPU的用户(提高市占率),并将高性能图形的一种与众不同的解决方案带向市场。” AMD RTG VP & GM,Scott Herkelman称。“我们共同向游戏玩家和内容创作者提供能在3A大作和内容创作程序中,具备独显级别性能的更轻更薄的PC。新的半定制GPU把Radeon显卡带给了对视觉性能没有妥协的新一类发烧友。”


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设计的核心是Intel的EMIB技术。同时它也是首个采用HBM2显存的移动PC处理器。HBM2结合EMIB,极大地节省了空间的占用,有助于达成更小更轻薄的设计。


Intel和AMD自从上世纪八十年代就是竞争对手,但这次Intel选择了AMD而不是NVIDIA。此次合作并不是把显示技术授权给Intel。


一名AMD发言人称,Intel的新芯片打造的笔记本不会与自家的Ryzen Mobile直接竞争。【CPU性能相差不大,但显示性能还是有差距的】

他说Intel的这款芯片主要是为高要求玩家打造,而Ryzen Mobile只需要能够流畅运行游戏,而不是专为游戏打造。


“我们正处于一个互相取长补短的市场中,” 该发言人说到。


本文地址:http://www.moepc.net/?post=3501



目前曝光的型号有i7-8809G、i7-8706G、i7-8705G

性能方面虽然有分数但并不可靠,泄露分数的低端大致性能在GTX950级别,高端为R9 380级别

都是各方面的泄露数据,一切以最终发布规格为准。


QQ截图20171107163144.png



AMD桌面平台首发GPU规格

QQ截图20171107160610.png




参考阅读:

Intel新NUC路线图:"Hades Canyon VR", KabyLake四核+独显
http://www.moepc.net/?post=3061


Intel用AMD集显? - 只是MCM,代号"Palo Alto"
http://www.moepc.net/?post=2154


新闻原文:

New Intel Core Processor Combines High-Performance CPU with Custom Discrete Graphics from AMD to Enable Sleeker, Thinner Devices


New Intel Design and Packaging Innovations Reduce Silicon Footprint by More Than 50%, Enable Real Time Power Sharing Across CPU and GPU for Optimal Performance

By Christopher Walker

We often talk about our focus on driving innovation for the enthusiast community, a targeted but growing segment of the PC market. This point is underscored by what we have been delivering with our Intel® Core™ X-series processors, Intel® Core™ H-series mobile processors and, more recently, the first of our 8th Gen Intel® Core™ desktop processors. Each product line offers a range of new capabilities, workloads and form factors to cater to the diverse needs of enthusiasts.

But as we looked at this lineup, we recognized an opportunity: thinner, lighter, more powerful enthusiast mobile platforms that deliver a premium experience. Currently, most enthusiast mobile PCs have Intel Core H-series processors plus higher-powered discrete graphics1, resulting in systems that average 26 mm in height. Compare this to thin and light laptops that are trending down to 16 mm or less, with some even as thin as 11 mm.

We wanted to find a way to improve this. A way to deliver a stronger combination of performance-level processors and discrete graphics that open the door to even smaller form factors.  And, we knew we could do it by combining our Embedded Multi-Die Interconnect Bridge (EMIB) technology with a new power-sharing framework.

Today, we’re sharing initial details on a new product that does exactly that, reducing the usual silicon footprint to less than half that of standard discrete components on a motherboard. That’s more freedom for OEMs to be creative and deliver innovative thin and light designs with improved thermal dissipation. It also delivers space to add new features, create new board layouts, explore new cooling solutions or increase battery life.

The new product, which will be part of our 8th Gen Intel Core family, brings together our high-performing Intel Core H-series processor, second generation High Bandwidth Memory (HBM2) and a custom-to-Intel third-party discrete graphics chip from AMD’s Radeon Technologies Group* – all in a single processor package.

It’s a prime example of hardware and software innovations intersecting to create something amazing that fills a unique market gap. Helping to deliver on our vision for this new class of product, we worked with the team at AMD’s Radeon Technologies Group. In close collaboration, we designed a new semi-custom graphics chip, which means this is also a great example of how we can compete and work together, ultimately delivering innovation that is good for consumers.

“Our collaboration with Intel expands the installed base for AMD Radeon GPUs and brings to market a differentiated solution for high-performance graphics,” said Scott Herkelman, vice president and general manager, AMD Radeon Technologies Group. “Together we are offering gamers and content creators the opportunity to have a thinner-and-lighter PC capable of delivering discrete performance-tier graphics experiences in AAA games and content creation applications. This new semi-custom GPU puts the performance and capabilities of Radeon graphics into the hands of an expanded set of enthusiasts who want the best visual experience possible.”

At the heart of this new design is EMIB, a small intelligent bridge that allows heterogeneous silicon to quickly pass information in extremely close proximity. EMIB eliminates height impact as well as manufacturing and design complexities, enabling faster, more powerful and more efficient products in smaller sizes. This is the first consumer product that takes advantage of EMIB.

Similarly, the power sharing framework is a new connection tailor-made by Intel among the processor, discrete graphics chip and dedicated graphics memory. We’ve added unique software drivers and interfaces to this semi-custom discrete GPU that coordinate information among all three elements of the platform. Not only does it help manage temperature, power delivery and performance state in real time, it also enables system designers to adjust the ratio of power sharing between the processor and graphics based on workloads and usages, like performance gaming. Balancing power between our high-performing processor and the graphics subsystem is critical to achieve great performance across both processors as systems get thinner.


Intel introduces a new product in the 8th Gen Intel Core processor family that combines a high-performance CPU with discrete graphics and HBM2 for a thin, sleek design. A comparison shows the space these components take on a traditional board (left) and on the new 8th Gen Intel Core processor that combines the components all on one package. (Credit: Intel Corporation)


Additionally, this solution is the first mobile PC to use HBM2, which consumes much less power and takes up less space compared to traditional discrete graphics-based designs using dedicated graphics memory, like GDDR5 memory.

This new addition to the 8th Gen Intel Core processor family builds on our strong portfolio of mobile and graphics solutions. Our 8th Gen and 7th Gen Intel Core processors brought capabilities like brilliant 4K content creation and consumption in amazing new designs. And as the leading supplier of PC Graphics, media and display technologies2, we deliver the visual experience to the majority of computers with our Intel HD and UHD graphics. Now, we’re opening the door for thinner, lighter devices across notebooks, 2 in 1s and mini desktops, while delivering incredible performance and graphics for enthusiasts.

Some might say the PC market is mature and has been for some time. At Intel, we challenge that notion every day. We are always creating new possibilities people haven’t seen or experienced. Look for more to come in the first quarter of 2018, including systems from major OEMs based on this exciting new technology.

Chris Walker is vice president of the Client Computing Group and general manager of the Mobile Client Platform at Intel Corporation.


本文地址:http://www.moepc.net/?post=3501

via:https://www.wsj.com/articles/rivals-intel-and-amd-team-up-on-pc-chips-to-battle-nvidia-1509966064

https://newsroom.intel.com/editorials/new-intel-core-processor-combine-high-performance-cpu-discrete-graphics-sleek-thin-devices/

beyond3Dforum

https://forum.beyond3d.com/posts/2009849/

bitsandchips@twitter

MOEPC.NET编译,转载请保留出处。

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本文作者:剧毒术士马文      文章标题: 没有永远的敌人:Intel和AMD宣布合作打造第八代酷睿​处理器,Kaby Lake-H + Polaris 独显
本文地址:http://mykancolle.com/?post=3501
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WRITTEN BY

avatar
RitterLeeGoogle Chrome 61.0.3163.100Windows 72017-11-13 22:33
Cannon Lake跳票,raven ridge不八核的情况下这东西算是高端笔电市场除了8550加了两核外唯一的安慰了,就是不知道散热怎么压····
剧毒术士马文Google Chrome 62.0.3202.89Windows 102017-11-13 23:33
@RitterLee:Raven Ridge比较好压的...有cTDP,按需配置,什么散热配什么性能
8550为了能维持高频,有不少机子cTDP配置远不止25W,比如XPS
RitterLeeGoogle Chrome 61.0.3163.100Windows 72017-11-14 01:48
@剧毒术士马文:主要疑惑的是8809G 感觉偏轻薄本应该压不住吧?100多W能压住么?
剧毒术士马文2017-11-14 10:21
@RitterLee:压不住的
超薄游戏本可以
15W那种不可能...
appleacheGoogle Chrome 62.0.3202.84Linux2017-11-10 04:37
如果intel肯把定价放低点说不定能进入“生产力”超极本市场,比如surface book,xps15这种。不过只是如果。。。。。按intel尿性基本上是。。。。不会的。
另外这个芯片面积看着是桌面版,估计imac定制,不知道会不会有笔记本版
剧毒术士马文Google Chrome 62.0.3202.89Windows 102017-11-13 23:35
@appleache:是啊,我现在XPS15用的标压感觉还是有点勉强,如果是低压版然后cTDP配高效果会更好

Intel发布说的是超极本,而且这堆100W左右TDP也就相当于i7 HQ+1050的TDP
轮子妈Google Chrome 61.0.3163.100Windows 8.12017-11-10 00:02
真机图上没有外置的南桥?
轮子妈Google Chrome 61.0.3163.100Windows 8.12017-11-10 00:04
@轮子妈:另外半定制芯片,用哪种显存控制器都是可配置的吧。
剧毒术士马文Google Chrome 62.0.3202.89Windows 102017-11-10 01:20
@轮子妈:是的。AMD的架构都是模块化可配置的,看这几代主机和GPU就知道,是一个个升级的。
轮子妈Google Chrome 61.0.3163.100Windows 8.12017-11-10 00:04
@轮子妈:南桥似乎在SSD下方。。
MikiyaGoogle Chrome 60.0.3112.107Linux2017-11-08 13:56
Raja :溜了溜了
LuluEhhGoogle Chrome 59.0.3071.30Windows 102017-11-08 09:48
真是惊了。。
连续两天大新闻。。
RAJA辞职了。。。。
ayuGoogle Chrome 40.0.2214.89Linux2017-11-08 10:18
@LuluEhh:早就猜到了!
hypnuswSafari 604.1.38Mac OSX 10_12_62017-11-08 11:43
@LuluEhh:明天再来个大新闻RTG卖给Intel?
剧毒术士马文2017-11-08 12:53
@hypnusw:你可能想太多
香霖堂杂工Google Chrome 62.0.3202.89Windows 72017-11-08 16:12
@剧毒术士马文:raja貌似跑到英特尔去搞这个了。。。
剧毒术士马文Google Chrome 62.0.3202.89Windows 102017-11-08 16:28
@香霖堂杂工:在确凿信息出来前不要相信一切谣言。
ayuGoogle Chrome 40.0.2214.89Linux2017-11-08 07:49
恕我直言:国内媒体连狗都不如,收钱办事的玩意儿。像洗衣粉网,它的赞助商是先马、影驰、酷冷至尊和锤子等等,尤其是先马赞助最多,故又称其“先马网”,时不时做个评测安利一下上面厂商的产品。

至于新闻真实性,这个不在它考虑范围内,浏览它网站的人,也只是看看评论而已。

PS:洗衣粉网早在2014年后就已经没落了,现在和蛆家一样,属于三流儿娱乐网站。
剧毒术士马文2017-11-08 12:52
@ayu:I can't agree more
NiceMingGoogle Chrome 61.0.3163.100Windows 72017-11-07 16:38
我反应过来了    简单理解一下  从AMD的角度来看这就是一个捆绑销售的策略
对AMD来说  如果只用在高性能笔记本上 觉得可能无所谓

毕竟单CCX的Ryzen APU性能对比core i7最多打平手
很明显 AMD自己早就承认不可能一下在OEM市场占据50%以上的份额  就算产品方方面面都能吊打intel  GF那要命的产能也支撑不了

明年refresh 12nm以后 据说要推出一个12nm的低功耗的Ryzen CPU
到时候再看看
NiceMingGoogle Chrome 61.0.3163.100Windows 72017-11-07 16:48
@NiceMing:而且如果指示polaris级别的话 对于明年要推出的vega24 和vega32也够不成竞争关系
此外  如果intel能够帮助助推HBM2销售   相信能极大的刺激HBM2的产能
也能带来足够的现金流  还能让游戏厂商对A卡进行更深度优化
对于AMD来说     是收益远大于损失的。
对于intel来说  也是可以接受的--------看样子明年苹果15寸还是intel芯了  13寸有待考量 除非AMD能得到雷电接口授权
剧毒术士马文2017-11-07 17:08
@NiceMing:雷电得到明年
ccFirefox 56.0Windows 102017-11-07 16:31
内存和显存还是分开,和现在的独显架构一样啊,并不是统一内存。
剧毒术士马文Google Chrome 62.0.3202.89Windows 102017-11-07 16:58
@cc:是的啊
一开始就说了是dGFX,独显,EMIB胶水
集显涉及授权问题。
ayuGoogle Chrome 40.0.2214.89Linux2017-11-07 12:11
马文,Intel的EMIB和AMD的IF,两者哪个效率更高?
剧毒术士马文2017-11-07 16:12
@ayu:现在啥都没有你让我怎么回答
EMIB和MCM/Interposer差不多,属于多芯片
IF则有片上和芯片间两种
wangbaisen1990Google Chrome 40.0.2214.89Linux2017-11-07 11:59
额直接带hbm2
连内存占用都剩了
这是高端货吧
另外amd可能看中了intel的oem渠道独大现象
打算靠这个在笔记本和nuc市场提升占有比例吧
剧毒术士马文2017-11-07 16:07
@wangbaisen1990:GPU算中端吧,1536SP,规格不算很高
wangbaisen1990Google Chrome 40.0.2214.89Linux2017-11-07 17:24
@剧毒术士马文:对于笔记本核显来说算是高端吧
剧毒术士马文Google Chrome 62.0.3202.89Windows 102017-11-07 17:29
@wangbaisen1990:这不是核显
只是换了封装的独显。
wangbaisen1990Google Chrome 40.0.2214.89Linux2017-11-07 19:15
@剧毒术士马文:哦
不过66w和100w这个tdp也对各种低端独显+i5hq/i7hq的市场冲击大吧
剧毒术士马文2017-11-07 22:18
@wangbaisen1990:但这样的配置现在基本没有了吧,低端独显现在都会搭配U系低压,定位轻薄和够用的性能

KabyLake-G冲击力如何还是要看性能,1050以下的独显的确会受到冲击
wangbaisen1990Google Chrome 40.0.2214.89Linux2017-11-08 00:56
@剧毒术士马文:嗯少见了很多,但是1050/1050ti还是主流
所以看看对这些冲击咋样
另外低压u+950m什么mx150的那些也是被冲击对象,不过我觉得这种会先被ryzen的apu冲击
111Google Chrome 36.0.1941.0Windows 8.12017-11-12 16:48
@剧毒术士马文:这个冲击的就是目前一堆i5/i7+1050/1050ti的市场~
剧毒术士马文2017-11-12 18:27
@111:性能接近1060
1060也不会很好过
而且1060+i7做不了太轻薄,除非Max-Q,不过那性能...
RitterLeeGoogle Chrome 61.0.3163.100Windows 72017-11-13 22:40
@剧毒术士马文:对了,想问下Cannon Lake是不是就是8代标压移动版,意思就是8XXXHQ基本上明年可以不用等了?
剧毒术士马文2017-11-13 23:28
@RitterLee:Cannon Lake还不是
前面还有个14nm++的Coffee Lake-H 六核移动版
Cannonlake不出意外只会有低压产品。

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